Industry Collaborations

HESL has industry collaborations with companies that are actively involved in embedded systems research and development. Some of the companies that have close working relations with HESL are listed here.

Infineon (Asia Pacific) Pte Ltd
In December 1998, Infineon (Asia Pacific) Pte Ltd, has signed a Memorandum of Understanding with the Centre to promote industry-oriented R&D work at CHiPES for a three year period. In its collaboration, Infineon has agreed to commit approximately 1.2 million dollars over a three-year period. This collaboration confirms the significance of research and development work in embedded systems, which is crucial for the development of novel and market viable intelligent products. Infineon has further extended the MOU for another 3 years on the same basis, December 2004. In January 2006, Infineon revised the MOU and extended it till December 2010. In January 2011, Infineon revised the MOU and extended it till December 2015.

NEC Electronics Singapore Pte Ltd
NEC has given its strong support for the NSTB funded Advanced Hardware Acceleration initiative at CHiPES. It wishes to establish close collaboration, which will be based on the development of High performance architectures for accelerating various classes of applications that are interest to their industry.

Philips Singapore Ltd
Philips has donated a supply of Microcontroller development boards and CPLDs to promote Philips product based novel embedded product developments at CHiPES.

SubMetrix Pte Ltd.,UK
SubMetrix has donated the sum of S$5,000 to support R&D work in the area of 3D Imaging using interferometric sonar systems.

EPECom Technology & Distribution Pte Ltd, Singapore
EPECom has shown interest in the development of a highly versatile Digital Voice Mail System for the consumer market. It is envisaged that NSTB grant will be sought to support this work at CHiPES.

Panasonic Singapore Laboratories Pte Ltd (PSL)
Panasonic Singapore Laboratories Pte Ltd (PSL) has entered into an agreement with the Centre for High Performance Embedded Systems (CHIPES) on 3rd April 2001 to collaborate on joint research and development on computer algorithms and embedded system architectures for high rate wireless personal area network (WPAN) baseband processor. Under this collaboration, PSL has agreed to invest a sum of S$100,000 to promote joint R&D at CHIPES.